Interconnect Ribbon

Interconnect Ribbon /Tinned copper strip Application scope: It shall increase the efficiency of battery, lower the cost and improve the quality and pass rate for the manufacturer. Component of plating layer:Sn99/Ag0.3/Cu0.7 Meltingpoint :217 227 centi-degree Proposal soldering temperature : 380 430 centi-degree ( set up base on the thickness of Cu ) Crystalline silicon solar module technology consists of monocrystalline and polycrystalline silicon. These modules are made from silicon ingots that are sliced into wafers. These wafers are used as substrate materials when making the modules. These two technologies represent the majority of module technology today. Baotai supplies interconnect and bus ribbon used to maximize the performance and efficiency of the solar modules.